The photoresist residue, natural oxide layer, and organic contamination on the surface of pins and lead frames in MOS, IGBT, and thyristor packaging are key electrical defects that lead to increased contact resistance and leakage current drift. This hidden danger causes fluctuations in yield, increased rework frequency, and prolonged testing time at the manufacturing end, significantly restricting output efficiency and comprehensive equipment utilization.
Traditional power semiconductor packaging uses wet chemical cleaning, and companies have found some problems with this process during actual production, such as
① Incomplete cleaning: Chemical solutions are limited by surface tension, making it difficult for them to penetrate into ultrafine pins and micro sized gaps, resulting in difficult removal of residual glue from micro gaps.
② High environmental protection costs: Relying on strong acids, bases, or organic solvents, a large amount of hazardous waste liquid is generated, and the cost of environmental approval and treatment for enterprises is high.
③ Materials are prone to damage: Liquid medicine can easily cause over etching, surface oxidation, or chemical ion residue on metal pins, which poses a corrosion hazard.
④ High risk of deformation: The physical impact of high-pressure spray or ultrasonic fluid can easily cause mechanical deformation of ultra-thin pins.
CKD laser glue remover abandons traditional wet chemical cleaning and adopts advanced laser physical dry cleaning principle.
① Non destructive and precise peeling: By utilizing the huge difference in laser absorption rate between metal pins, chip substrates, and colloids, photons can accurately reach micrometer level slits, thoroughly removing adhesives and zero thermal damage to the substrate, perfectly ensuring the conductivity and voltage reliability of power devices.
② Green and zero pollution: zero chemical reagents and zero wastewater discharge throughout the process, eliminating hazardous chemical hazards in the workshop from the source and significantly reducing the comprehensive environmental management cost of enterprises.
③ High throughput automation operation: non-contact operation, second level cleaning, effectively avoiding the risk of pin deformation or wafer fragments that may be caused by traditional wet fluid impact, helping the production line to comprehensively reduce costs and increase efficiency.
From "chemical wet method" to "physical dry method", CKD uses green technology to overcome the bottleneck of power semiconductor cleaning and empower low-carbon and high reliability intelligent manufacturing!
